Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates

Author： Kim Cheolgyu   Lee Tae-Ik   Kim Min Sung   Kim Taek-Soo  

Publisher： MDPI

E-ISSN： 2073-4360|7|6|985-1004

ISSN： 2073-4360

Source： Polymers, Vol.7, Iss.6, 2015-06, pp. : 985-1004

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Mechanical Analysis of Stress Distribution in a Carbon Fiber-Reinforced Polymer Rod Bonding Anchor

By Feng Peng   Zhang Pan   Meng Xinmiao   Ye Lieping  

Polymers, Vol. 6, Iss. 4, 2014-04 ,pp. : 1129-1143

MDPI

Access to resources Recommend Favorite

Statistical Analysis of the Progressive Failure Behavior for Fiber-Reinforced Polymer Composites under Tensile Loading

By Wang Fang   Ding Jun   Chen Zhiqian  

Polymers, Vol. 6, Iss. 1, 2014-01 ,pp. : 145-159

MDPI

Access to resources Recommend Favorite

Sulfur incorporation in electroplated Cu(Ag) thin films

By Strehle Steffen   Reiche Rainer   Hoffmann Volker   Acker Jörg   Gemming Thomas   Wetzig Klaus  

Microchimica Acta, Vol. 156, Iss. 1-2, 2006-11 ,pp. : 167-172

Springer Publishing Company

Access to resources Recommend Favorite

Electrochemical behavior of coupled carbon fiber-reinforced polymer (CFRP) rods in concrete

By Torres-Acosta A.A.   Sen R.  

Journal of Applied Electrochemistry, Vol. 35, Iss. 6, 2005-06 ,pp. : 529-537

Springer Publishing Company

Access to resources Recommend Favorite

Improved Bond Equations for Fiber-Reinforced Polymer Bars in Concrete

By Pour Sadaf Moallemi   Alam M. Shahria   Milani Abbas S.  

Materials, Vol. 9, Iss. 9, 2016-08 ,pp. : 737-737

MDPI

Access to resources Recommend Favorite