Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices

Author： Carroll Lee   Lee Jun-Su   Scarcella Carmelo   Gradkowski Kamil   Duperron Matthieu   Lu Huihui   Zhao Yan   Eason Cormac   Morrissey Padraic   Rensing Marc   Collins Sean   Hwang How Yuan   O’Brien Peter  

Publisher： MDPI

E-ISSN： 2076-3417|6|12|426-426

ISSN： 2076-3417

Source： Applied Sciences, Vol.6, Iss.12, 2016-12, pp. : 426-426

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