Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer

Author: Chuang Chien-Hsun   Lin Yan-Cheng   Lin Che-Wei  

Publisher: MDPI

E-ISSN: 2075-4701|6|4|92-92

ISSN: 2075-4701

Source: Metals, Vol.6, Iss.4, 2016-04, pp. : 92-92

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