An Interference-Assisted Thermal Bonding Method for the Fabrication of Thermoplastic Microfluidic Devices

Author: Gong Yao   Park Jang Min   Lim Jiseok  

Publisher: MDPI

E-ISSN: 2072-666x|7|11|211-211

ISSN: 2072-666x

Source: Micromachines, Vol.7, Iss.11, 2016-11, pp. : 211-211

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Abstract