Deformation and Failure of Ultrafine-Grained Cu at Subambient Temperature

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2017|891|249-253

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2017, Iss.891, 2017-04, pp. : 249-253

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract