Publisher: Trans Tech Publications
E-ISSN: 1662-9752|2017|893|297-301
ISSN: 0255-5476
Source: Materials Science Forum, Vol.2017, Iss.893, 2017-05, pp. : 297-301
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Compressive Behaviour of Al-Si-Mg/SiCP Foams
Materials Science Forum, Vol. 2015, Iss. 830, 2015-10 ,pp. :
Interface Analysis of P-Type 4H-SiC/Al2O3 Using Synchrotron-Based XPS
Materials Science Forum, Vol. 2016, Iss. 858, 2016-06 ,pp. :
Numerical Analysis on the Density Uniformity for SiCp/2024Al in the Extrusion Process
Materials Science Forum, Vol. 2016, Iss. 850, 2016-04 ,pp. :