Demonstrating the Instability of SiC Ohmic Contacts and Drain Terminal Metallization Schemes Aged at 300 °C

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2017|897|387-390

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2017, Iss.897, 2017-06, pp. : 387-390

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Abstract