Validation of an Embedded-Atom Copper Classical Potential via Bulk and Nanostructure Simulations

Publisher： Trans Tech Publications

E-ISSN： 2296-3642|2017|12|74-92

ISSN： 2296-3650

Source： Diffusion Foundations, Vol.2017, Iss.12, 2017-11, pp. : 74-92

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