Examination of Thermal Parameters, Primary Dendritic Spacings and Microhardness of a Horizontally Solidified Al-Cu-Mg Ternary Alloy

Publisher： Trans Tech Publications

E-ISSN： 1662-9507|2017|379|133-139

ISSN： 1012-0386

Source： Defect and Diffusion Forum, Vol.2017, Iss.379, 2017-12, pp. : 133-139

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Abstract

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