The Thermal Stress Simulation of the Part Caused by Layer Thickness and Deposition Velocity in FDM Process
Publisher: Trans Tech Publications
E-ISSN: 1662-9795|2018|764|115-122
ISSN: 1013-9826
Source: Key Engineering Materials, Vol.2018, Iss.764, 2018-03, pp. : 115-122
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Abstract