Polyimide Encapsulation of Spider-Inspired Crack-Based Sensors for Durability Improvement

Author: Kim Taewi   Lee Taemin   Lee Gunhee   Choi Yong Whan   Kim Sang Moon   Kang Daeshik   Choi Mansoo  

Publisher: MDPI

E-ISSN: 2076-3417|8|3|367-367

ISSN: 2076-3417

Source: Applied Sciences, Vol.8, Iss.3, 2018-03, pp. : 367-367

Access to resources Favorite

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract