Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Author： Li Yulong   Long Weifeng   Hu Xiaowu   Fu Yanshu  

Publisher： MDPI

E-ISSN： 1996-1944|11|1|84-84

ISSN： 1996-1944

Source： Materials, Vol.11, Iss.1, 2018-01, pp. : 84-84

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