Fully Solution-Processable Fabrication of Multi-Layered Circuits on a Flexible Substrate Using Laser Processing

Author: Ji Seok Young   Choi Wonsuk   Kim Hoon-Young   Jeon Jin-Woo   Cho Sung-Hak   Chang Won Seok  

Publisher: MDPI

E-ISSN: 1996-1944|11|2|268-268

ISSN: 1996-1944

Source: Materials, Vol.11, Iss.2, 2018-02, pp. : 268-268

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Abstract