Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

Author： Sun Fu-Long   Liu Zhi-Quan   Li Cai-Fu   Zhu Qing-Sheng   Zhang Hao   Suganuma Katsuaki  

Publisher： MDPI

E-ISSN： 1996-1944|11|2|319-319

ISSN： 1996-1944

Source： Materials, Vol.11, Iss.2, 2018-02, pp. : 319-319

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