Epoxy-Thiol Systems Filled with Boron Nitride for High Thermal Conductivity Applications

Author： Hutchinson John M.   Román Frida   Folch Adrià  

Publisher： MDPI

E-ISSN： 2073-4360|10|3|340-340

ISSN： 2073-4360

Source： Polymers, Vol.10, Iss.3, 2018-03, pp. : 340-340

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