Tin whisker growth from electroplated finishes - a review

By Bunyan D   Ashworth M A   Wilcox G D   Higginson R L   Heath R J   Liu C  

Transactions of the Institute of Metal Finishing, Vol. 91, Iss. 5, 2013-09 ,pp. : 249-259

Maney Publishing

Access to resources Recommend Favorite

Growth behaviors of tin whisker in RE-doped Sn-Zn-Ga solder

By Ye Huan   Xue Songbai   Chen Cheng   Li Yang  

Soldering & Surface Mount Technology, Vol. 25, Iss. 3, 2013-06 ,pp. : 139-144

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Effect of Substrate Composition on Sn Whisker Growth in Pure Sn Films

By Miller Sarah   Sahaym Uttara   Norton M.  

Metallurgical and Materials Transactions A, Vol. 41, Iss. 13, 2010-12 ,pp. : 3386-3395

Springer Publishing Company

Access to resources Recommend Favorite

Effect of direct current and pulse plating parameters on tin whisker growth from tin electrodeposits on copper and brass substrates

By Ashworth M A   Wilcox G D   Higginson R L   Heath R J   Liu C  

Transactions of the Institute of Metal Finishing, Vol. 91, Iss. 5, 2013-09 ,pp. : 260-268

Maney Publishing

Access to resources Recommend Favorite

A Study of the Tensile Deformation and Fracture Behavior of Commercially Pure Titanium and Titanium Alloy: Influence of Orientation and Microstructure

By Bathini U.   Srivatsan T.   Patnaik A.   Quick T.  

Journal of Materials Engineering and Performance, Vol. 19, Iss. 8, 2010-11 ,pp. : 1172-1182

Springer Publishing Company

Access to resources Recommend Favorite