Formation of Cu₆Sn₅/(Cu, Ni)₆Sn₅ Intermetallic Compounds between Cu₃Sn-Rich Sn-Cu/Sn-Cu-Ni Powdered Alloys and Molten Sn by Transient Liquid Bonding

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2018|273|14-19

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2018, Iss.273, 2018-06, pp. : 14-19

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