Publisher： Edp Sciences
E-ISSN： 2100-014x|159|issue|00050-00050
ISSN： 2100-014x
Source： EPJ Web of Conference, Vol.159, Iss.issue, 2017-10, pp. : 00050-00050
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Abstract
A promising way to remove heat fluxes from the surfaces of electronic devices with high heat generation is the use of evaporating thin liquid film, moving under the action of gas flow in a channel. On the basis of the studies conducted previously, we have developed a pilot model of the experimental-industrial prototype for removing heat fluxes with densities of up to 1000 W/cm2 from the surface of the heat-stressed element with dimensions 10x10 mm2. Testing of the model has proved its efficiency in continuous operation.
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