The Development of High Thermal Conductivity SiC Power Modules through the Implementation of Advanced Cooling Techniques Coupled with High Heat Transfer Materials

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2018|924|866-870

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2018, Iss.924, 2018-07, pp. : 866-870

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