Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Author： Tada Naoya   Tanaka Takuhiro   Uemori Takeshi   Nakata Toshiya  

Publisher： MDPI

E-ISSN： 2073-4352|7|8|255-255

ISSN： 2073-4352

Source： Crystals, Vol.7, Iss.8, 2017-08, pp. : 255-255

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