Packaging Reliability Effect of ENIG and ENEPIG Surface Finishes in Board Level Thermal Test under Long-Term Aging and Cycling

Author： Shen Chaobo   Hai Zhou   Zhao Cong   Zhang Jiawei   Evans John L.   Bozack Michael J.   Suhling Jeffrey C.  

Publisher： MDPI

E-ISSN： 1996-1944|10|5|451-451

ISSN： 1996-1944

Source： Materials, Vol.10, Iss.5, 2017-04, pp. : 451-451

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