Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

Author: Zain-ul-abdein Muhammad   Ijaz Hassan   Saleem Waqas   Raza Kabeer   Salmeen Bin Mahfouz Abdullah   Mabrouki Tarek  

Publisher: MDPI

E-ISSN: 1996-1944|10|7|739-739

ISSN: 1996-1944

Source: Materials, Vol.10, Iss.7, 2017-07, pp. : 739-739

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Abstract