A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications

Author: Shao Shuai   Liu Dapeng   Niu Yuling   O’Donnell Kathy   Sengupta Dipak   Park Seungbae  

Publisher: MDPI

E-ISSN: 1424-8220|17|2|322-322

ISSN: 1424-8220

Source: Sensors, Vol.17, Iss.2, 2017-02, pp. : 322-322

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Abstract