Mechanical Response of Nano-Porous Copper under Different Temperature and Strain Rate through Molecular Dynamics Simulations

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2018|933|297-303

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2018, Iss.933, 2018-11, pp. : 297-303

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