Effect of Cooling Speed on the Microstructure and Mechanical Properties of Sn-0.7Cu-0.05Ni Solder Alloy

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2018|934|73-78

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2018, Iss.934, 2018-11, pp. : 73-78

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Abstract