Understanding the effects of adhesive layer on the electromechanical impedance (EMI) of bonded piezoelectric wafer transducer

Publisher： IOP Publishing

E-ISSN： 1361-665X|23|12|125037-125050

ISSN： 0964-1726

Source： Smart Materials and Structures, Vol.23, Iss.12, 2014-12, pp. : 125037-125050

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