Study of the Hole Transport Processes in Solution‐Processed Layers of the Wide Bandgap Semiconductor Copper(I) Thiocyanate (CuSCN)

Publisher： John Wiley & Sons Inc

E-ISSN： 1616-3028|25|43|6802-6813

ISSN： 1616-301x

Source： ADVANCED FUNCTIONAL MATERIALS, Vol.25, Iss.43, 2015-11, pp. : 6802-6813

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