Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|754|546-550

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 546-550

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 551-555

Trans Tech Publications

Access to resources Recommend Favorite

The Effect of Dipping Time to the Intermetallic Compound and Free Solder Thickness of Sn-Cu-Ni (SN100C) Lead-Free Solder Coating

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 493-497

Trans Tech Publications

Access to resources Recommend Favorite

Sn-Cu-Ni (SN100C) Lead-Free Solder Coating Wettability Study

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 489-492

Trans Tech Publications

Access to resources Recommend Favorite

Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 518-523

Trans Tech Publications

Access to resources Recommend Favorite

Influence of Micron-Size Activated Carbon Additions on the Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni (SN100C) Solder Fabricated via Powder Metallurgy Method

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 513-517

Trans Tech Publications

Access to resources Recommend Favorite