The Mechanical Characterization of Bending Test for MEMS Capacitive Pressure Sensor Based 3C-SiC in High Temperature

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|754|602-605

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 602-605

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