Detection and formation mechanism of micro-defects in ultrafine pitch Cu—Cu direct bonding

Author： Liu Zi-Yu   Cai Jian   Wang Qian   Chen Yu  

Publisher： IOP Publishing

E-ISSN： 1741-4199|25|1|18103-18109

ISSN： 1674-1056

Source： Chinese Physics B, Vol.25, Iss.1, 2016-01, pp. : 18103-18109

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