Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

Author： Liu Yang Sun Fenglian Yuan Cadmus A. Zhang Guoqi

E-ISSN： 1758-812X|33|1|42-46

ISSN： 1356-5362

Source： Microelectronics International, Vol.33, Iss.1, 2016-01, pp. : 42-46

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