Simulation and Analysis of Temperature Distribution and Material Properties Change of a Thermal Heat sink Undergoing Thermal Loading in a Mobile Computer

Publisher： IOP Publishing

E-ISSN： 1757-899X|88|1|317-323

ISSN： 1757-899X

Source： IOP Conference Series: Materials Science and Engineering, Vol.88, Iss.1, 2015-09, pp. : 317-323

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