Examination of Thin Film Uniformity at the Bottom of a Hole Structure Using a 3D Sputter Simulation Package

Publisher: Edp Sciences

E-ISSN: 1286-4897|6|9|1213-1218

ISSN: 1155-4320

Source: Journal de Physique III, Vol.6, Iss.9, 1996-09, pp. : 1213-1218

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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