A Novel Acceleration-Factor Equation for Packaging-Solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates

Publisher: Cambridge University Press

E-ISSN: 1811-8216|33|1|35-40

ISSN: 1727-7191

Source: Journal of Mechanics, Vol.33, Iss.1, 2016-05, pp. : 35-40

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Abstract