Relationship between rheological and electrical percolation in a polymer nanocomposite with semiconductor inclusions

Author： Zohrevand Ahmad   Ajji Abdellah   Mighri Frej  

Publisher： Springer Publishing Company

ISSN： 0035-4511

Source： Rheologica Acta, Vol.53, Iss.3, 2014-03, pp. : 235-254

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Related content

Uniaxial deformation and relaxation of polymer blends: relationship between flow and morphology development

By Mechbal Nizar   Bousmina Mosto  

Rheologica Acta, Vol. 43, Iss. 2, 2004-03 ,pp. : 119-126

Springer Publishing Company

Access to resources Recommend Favorite

Electrical Characteristics of Three-Component Dielectric Composites with Close-Packed Inclusions

By Emets Y.P.  

Journal of Applied Mechanics and Technical Physics, Vol. 42, Iss. 4, 2001-07 ,pp. : 704-713

Springer Publishing Company

Access to resources Recommend Favorite

Rheological and diffusion properties of a dextran-con A polymer in the presence of Insulin and Magnesium

By Adams Gary   Cui Yuxin   Mitchell John   Taylor M.  

Rheologica Acta, Vol. 45, Iss. 5, 2006-06 ,pp. : 611-620

Springer Publishing Company

Access to resources Recommend Favorite

Rheological and diffusion properties of a dextran-con a polymer in the presence of insulin and magnesium

By Adams Gary   Cui Yuxin   Mitchell John   Taylor M.  

Rheologica Acta, Vol. 46, Iss. 3, 2007-01 ,pp. : 425-426

Springer Publishing Company

Access to resources Recommend Favorite

Comparative rheological studies of polyamide-6 and its low loaded nanocomposite based on layered silicates

By Ayyer Ravishankar   Leonov Arkady  

Rheologica Acta, Vol. 43, Iss. 3, 2004-05 ,pp. : 283-292

Springer Publishing Company

Access to resources Recommend Favorite