Author： Goosey M
Publisher： Maney Publishing
ISSN： 0020-2967
Source： Transactions of the Institute of Metal Finishing, Vol.91, Iss.4, 2013-07, pp. : 173-175
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Abstract
Conventional approaches to the fabrication of fine features in the printed circuit board and metal finishing industries typically employ a multistage photolithography stage to process each individual substrate, which is both inefficient and wasteful of valuable materials. By developing and implementing a maskless electrochemical process that decreases the use of lithography, the Mesmoproc project aims to assist European industry in these sectors.
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