Author: Berthier F. Legrand B. Creuze J. Tetot R.
Publisher: Elsevier
ISSN: 0022-0728
Source: Journal of Electroanalytical Chemistry and Interfacial Electrochemistry, Vol.562, Iss.1, 2004-01, pp. : 127-134
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Related content
Surface Growth and Diffusion Energetics of Ag Monolayers on Cu (001)
Metals, Vol. 4, Iss. 2, 2014-04 ,pp. :
Electrodeposition of copper: the nucleation mechanisms
Electrochimica Acta, Vol. 47, Iss. 18, 2002-07 ,pp. :