Physics of failure for interconnect structures: an essay

Author: Tilgner Rainer  

Publisher: Springer Publishing Company

ISSN: 0946-7076

Source: Microsystem Technologies, Vol.15, Iss.1, 2009-01, pp. : 129-138

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract