Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

Author: Mei Yunhui   Chen Gang   Li Xin   Lu Guo-Quan   Chen Xu  

Publisher: Emerald Group Publishing Ltd

ISSN: 0954-0911

Source: Soldering & Surface Mount Technology, Vol.25, Iss.2, 2013-04, pp. : 107-116

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