Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey-based Taguchi method

Author： Lau Chun-Sean   Abdullah M.Z.   Khor C.Y.  

Publisher： Emerald Group Publishing Ltd

ISSN： 1356-5362

Source： Microelectronics International, Vol.30, Iss.3, 2013-07, pp. : 151-168

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