Quality improvement for wire bond strength within the semiconductor manufacturing environment

ISSN： 1479-2494

Source： International Journal of Six Sigma and Competitive Advantage, Vol.7, Iss.2-4, 2012-04, pp. : 151-167

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Quality costing: the application of the process model within a manufacturing environment

By Goulden Clive Rawlins Louise

International Journal of Operations & Production Management, Vol. 17, Iss. 2, 1997-02 ,pp. : 199-210

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Empirical Analysis of Quality Improvement in Manufacturing

By Maani K.E. Putterill M.S. Sluti D.G.

International Journal of Quality & Reliability Management, Vol. 11, Iss. 7, 1994-07 ,pp. : 19-37

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Quality communication within a connected manufacturing supply chain

By Roethlein Christopher Ackerson Sara

Supply Chain Management: An International Journal, Vol. 9, Iss. 4, 2004-09 ,pp. : 323-330

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Continuous quality improvements in a high-technology manufacturing environment

By Sohal Amrik S. Lu Edmund

International Journal of Technology Management, Vol. 16, Iss. 4-5, 1998-07 ,pp. : 336-357

Inderscience Publishers

Access to resources Recommend Favorite

HR manager leadership in quality improvement in a college environment

By Sharabi Moshe

Quality Assurance in Education, Vol. 18, Iss. 4, 2010-09 ,pp. : 317-327

Emerald Group Publishing Ltd

Access to resources Recommend Favorite