Fabrication of Advanced Bump Layer for IC Power Delivery

Author： Oh Keonghwan Ma Jun-Sung Kim Sungdong Kim Sarah Eunkyung

Publisher： American Scientific Publishers

ISSN： 1533-4899

Source： Journal of Nanoscience and Nanotechnology, Vol.13, Iss.9, 2013-09, pp. : 6447-6450

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