Experimental Evaluation of Selective Adhesive Coating in Chip Transfer Process for Flexible Electronic Substrates Using Atmospheric Plasma

Author： Park Jeahho   Lee Hye Jin   Kwag Dong-Gi   Lee Nak Kyu   Song Jung Han  

Publisher： American Scientific Publishers

ISSN： 1936-6612

Source： Advanced Science Letters, Vol.19, Iss.12, 2013-12, pp. : 3445-3448

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