FE Analysis of Cure-Process-Induced Residual Stress in Light Emitting Diode Encapsulant Silicone Resin Considering Mechanical Property Evolution

Author： Song Min-Jae   Kim Kwon-Hee   Kang Jeong Jin   Yoon Gil-Sang   Kim Heung-Kyu  

Publisher： American Scientific Publishers

ISSN： 1936-6612

Source： Advanced Science Letters, Vol.19, Iss.12, 2013-12, pp. : 3433-3440

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