Yield stress influenced by the ratio of wire diameter to grain size - a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires

Author: Yang B.  

Publisher: Taylor & Francis Ltd

ISSN: 1478-6443

Source: Philosophical Magazine, Vol.92, Iss.25-27, 2012-09, pp. : 3243-3256

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Abstract