Influence of boundary structure and near neighbor crystallographic orientation on the dynamic damage evolution during shock loading

Author: Escobedo Juan P.   Cerreta Ellen K.   Dennis-Koller Darcie   Trujillo Carl P.   Bronkhorst Curt A.  

Publisher: Taylor & Francis Ltd

ISSN: 1478-6443

Source: Philosophical Magazine, Vol.93, Iss.7, 2013-03, pp. : 833-846

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

The role of crystallographic orientation on damage evolution in ductile metals during shock loading has been investigated. By utilizing large-grained copper specimens, it has been shown that the development of intragranular damage, in the form of void growth and coalescence, is influenced by the grain orientation with respect to the applied load. Additionally, strain incompatibility and the inability to promote transmission or activation of secondary dislocation slip across a grain boundary, are proposed as the likely cause for intergranular failure. Finally, the free surface velocity profiles of each grain, specifically the decay of the oscillations after the pull-back, correlated well with the amount of damage measured within the respective grain.