Growth mechanism and structure of electrodeposited Cu/Ni multilayers

Author: Troyon M.   Wang L.   Fricoteaux P.   Bonhomme P.   Metrot A.   Douglade J.   Yu-Zhang K.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.261, Iss.1, 1995-06, pp. : 160-167

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Abstract