Passivation of Cu via refractory metal nitridation in an ammonia ambient

Author: Adams D.   Alford T.L.   Theodore N.D.   Russell S.W.   Spreitzer R.L.   Mayer J.W.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.262, Iss.1, 1995-06, pp. : 199-208

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Abstract