Investigation on metallurgical properties and electromigration in AlCu metallizations for VLSI applications

Author: Dietrich S.   Schneegans M.   Moske M.   Samwer K.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.275, Iss.1, 1996-04, pp. : 159-163

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Abstract