Author: Dorfman S. Fuks D. Kotomin E.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.318, Iss.1, 1998-04, pp. : 65-68
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Atomistic Study of the Copper Cluster Deposition on Si(001) and Si(111) Surface
Materials Science Forum, Vol. 2016, Iss. 850, 2016-04 ,pp. :
By Pieczyrak Barbara Jurczyszyn Leszek Stankiewicz Barbara
Czechoslovak Journal of Physics, Vol. 56, Iss. 1, 2006-01 ,pp. :